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An approach for Testing memory

2.2.2. Special tests


- Electrical Design Verification Test (EDVT) is a test performed on the products prior their entering in the production phase. Its main purpose is to validate the electrical design of the product as well as the used materials and components for proper working at environmental stress conditions.
- Material Change Verification Test (MCVT) is a test performed for qualifying new parts or new vendors during the sustained phase of the production. The qualified parts and vendors are included in AVL. MCVT is very similar to EDVT in terms of the tests and the way they are performed.
- High Potential Test (Hi-Pot) is performed with high voltage, usually over 1000V and its purpose is to certify the product insulation is in compliance with the respective regulatory documents.
- Burn-in test is a test process designed for inducing the initial higher number of defects to appear during the manufacturing rather than at the field. For this purpose the product is tested at stress environmental conditions such as increased temperature, and increased voltage.

2.2.3. Product Specific Tests (PST) are real functional tests and they are specific for each particular product.

2.2.4. Built-in Self Test (BIST) is a conception for creating hardware and software structures inside a component allowing for it to self test.

2.2.5. 2-Corner (2C) –the units are tested under low and high temperatures




Fig. 3. Typical functional test station



  1. Basic steps in test strategy creation.


Developing a test strategy for electronic products [4] is as important as developing the product itself. This is a complex task that must take into account all aspects of product, including its design, complexity and type of board, the purpose of the device. It is necessary developing a test strategy to start at the outset to design the product and be done in parallel with it.
Here are the essential elements of a test strategy and they include the following phases: Phase 1: Technical and financial analysis of the assembled PCB. Phase 2: Selection of proper tests equipment. Phase 3: Creation of the test strategy. In order to achieve the goals the test strategy must provide optimum coverage with minimal overlapping of the tests at minimal cost. Phase 4: Test strategy realization. Phase 5: Test metrics analysis. Phase 6: Change and improvement of the test strategy if necessary.


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