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- 2.1. Structural Tests
- 2.1.2. Manufacturing Defect Analyzer (MDA)
Types of testThere are two main test groups – Structural tests and Functional tests. The structural tests check the structure of the PCB/PCBA for open or short circuits; the quality of the solder joints; component presence and orientation etc. The functional tests validate the functionality of the devices and their performance (fig. 1). Fig.1. Classification of the tests in the electronics manufacturing 2.1. Structural Tests2.1.1. In Circuit Test (ICT)In Circuit Test (ICT) provides convenient and efficient way for testing boards circuits for opens and shorts as well as the components placement, orientation and value [1]. It is common during ICT some components, like CPLD or FPGA to be programmed or specific board information known as cookies to be written to an onboard EEPROM. 2.1.2. Manufacturing Defect Analyzer (MDA)MDA is a simplified variant of ICT. It is used mainly for testing PCBs for opens, shorts and values of some components. Its coverage is limited compared to ICT, but its advantage is the significantly lower cost. 2.1.3. JTAG Boundary scan testingJTAG test (Boundary scan logic) uses special integrated circuits with built-in shift registers on their outputs [2]. All JTAG compatible components are connected serially forming a loop. During the test the channel is enabled and test patterns are sent through it. At the output the test information is retrieved and analyzed. 2.1.4. Flying probe (FP) FP testers are used mainly for testing of prototypes and production boards with limited access to the tested components. These testers use electro-mechanically controlled probes to access the assembled PCB. Изтегляне 79.5 Kb. Сподели с приятели:
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